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Home >> Packaging & Paper >> Japan >> ICP - Ic Packaging Technology Expo ICP - Ic Packaging Technology Expo
This event is over - New dates are still awaited
Previous Trade Show Information is Below: Start Date 20-Jan-2010 End Date 22-Jan-2010
Industry Focus Packaging & Paper Event Profile ICP - IC Packaging Technology Expo is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing. Exhibitior Profile Profile of the Exhibitors are: Assembly Equipment, Wire Bonders, FC Bonders, Molding Machines, Dicing Machines, Laser Processors, Die Bonders, Other Various Bonders, Resin Coating Machines, Lead Processing Machines, Other Equipments for IC Packaging, Packaging Materials / Components, Sealant (Mold Materials) / Under-fill Materials etc. Visitor's Profile: The target of the Visitors are: manufacturing, engineering, SMT, design, R&D, quality control, purchasing, Semiconductor Manufacturers, Set Manufacturers (in high-density SMT), Assembly Manufacturers/SATS, MEMS Devices/LED Manufacturers, Sensor Manufacturers.
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