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ICP - Ic Packaging Technology Expo



This event is over - New dates are still awaited


Previous Trade Show Information is Below:


Start Date   20-Jan-2010   End Date   22-Jan-2010


Tokyo International Exhibition Center (Tokyo Big Sight)

3-21-1 Ariake, Koto-ku

Tokyo, Japan

Tel: +81-(0)3-55301111

Fax: +81-(0)3-55301222


Industry Focus

Packaging & Paper



Event Profile

ICP - IC Packaging Technology Expo is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing.



Exhibitior Profile

Profile of the Exhibitors are: Assembly Equipment, Wire Bonders, FC Bonders, Molding Machines, Dicing Machines, Laser Processors, Die Bonders, Other Various Bonders, Resin Coating Machines, Lead Processing Machines, Other Equipments for IC Packaging, Packaging Materials / Components, Sealant (Mold Materials) / Under-fill Materials etc.



Visitor's Profile:

The target of the Visitors are: manufacturing, engineering, SMT, design, R&D, quality control, purchasing, Semiconductor Manufacturers, Set Manufacturers (in high-density SMT), Assembly Manufacturers/SATS, MEMS Devices/LED Manufacturers, Sensor Manufacturers.


     



  Organizer Info  

Reed Exhibitions Japan

Address :- 18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - ku, Tokyo 163-0570 [ Japan ]

Phone : 81 - 03 - 33498501   Fax : 81 - 03 - 33498599

Contact Organizer




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